Save up to 9095% of the bga cost reballing cost will be 510% of the new bga cost reduce material inventory that can save millions of dollars a year. This instructable will use the solder preform process to teach you how to reball a plastic bga in about 10 minutes or less. A viable repair alternative to the numerous convective heat transfer problems listed above is the use of medium wavelength infrared. Our experience would indicate there is no need to change the process with a change in ball size or ball count. The reballing process consists of removing the leadfree solder balls from a bga component and replacing them with new snpb ones. Allow bga to cool for 30 60 seconds and remove polyimide solder ball stencil carrier from bga see figure 4. If bga reballing services are required then contact. Most of the time a reflow is based on generally known failures. This article describes the required bga reballing process, specifically the preform method. It has become somewhat more accepted to reflow devices like ps3 xbox etc. Reflow source reflow oven, hot air system, ir system2. Micross components has developed a proven process for reballing ball grid array bga components to restore them to their original specifications or to bring them up to standards for use in hirel applications. Impact of process control in pbfree to snpb reballing.
Most advanced laser reballing process retronix have a top of the line process that sets a benchmark for advanced laser reballing service. The conventional method is to remove the defective device, clean the pads on the pcb, then print solder paste on the pads with a ministencil. When we consider reworking an array package such as a bga or csp, it is recognised that process control is of paramount importance to achieve a successful. All series bga reballing stencil dedicate kit for iphone 4 4s 5 5s 5c 6 6p 6s 6sp 7 7p, iphone ipad bga ic chip bga reballing stencil kits solder template, bga stencil of solder mask ink repair paintshedding on bga chip. Chemicals used in reballing process can cause skin irritation. General process bga handling stencilquik method ezreball method high volume method dry packaging ceramic package reballing challenges optional services. Your board dimension to ensure that we can fit it into our rework machine. Isource technical services offers two solutions for bga rework and bga reballing.
Deball the device apply a water soluble paste flux using a syringe and apply a ball of the device with a gloved finger. Typically, this process is done with replacing solder balls of the same alloy, in order to maintain the same properties the component had before. The bga reballing process is explained in this slide set. The simple nature of the ezreball reballing process allows even the beginning repair technician to reliably and quickly replace balls on a bga package. Reballing means changing all the soldered balls on chip ball grid array circuit, there are a lot of different reasons why we need to reball a chip. Polyimide stencil technique reballing technique at.
Process bga handling stencilquik method ezreball method high volume method dry packaging ceramic package reballing challenges optional services. The solderquik bga preform provides a unique bga reballing solution. Bga or micro bga reballing kit custom designed and manufactured inhouse for use with your specific chip, each selfcontained kit includes everything you need to repair and reball bga chips. Laser reballing the most advanced process for high. Bgas can develop problems due to unreliable solder joints which have. A brief description of the reballing process as well as some of the inspection tools is also discussed. Remove existing solder spheres on bga components using desolder braid.
Remove the solder ball using the appropriate blade tip or temperature setting based on the solder ball alloy. Bga reballing procedure 7711 polyimide solder ball stencil. In the deball step, automated sphere removal is performed in a flexline robotic solder dip system which involves a controlled, gentle, multiunit process. The same process is applied except that the array of solder balls is placed directly onto the pads at the rework site and reflowed to the board using the rework nozzle. Bga reballing isi has an advanced, qualified process for removing and reballing solder spheres that is compatible to the assembly process criteria for any bga package. Stencilquik reballing this best developed reballing technique for area array devices is the designed for speed and fast turnaround of small to medium volume quantities. The apr reballing kit is used to place replacement solder balls onto bga components. May 29, 2012 this video demonstrates a safe and easy reballing process on a fineplacer hot gas rework system in order to repair a bga component. Effect of bga reballing and its influence on ball shear strength. For example, in the reballing process of a io package, if just one ball size is incorrect a 99. And i know pretty sure with the help of this article, i definitely gonna helps you to know every little detail about this reballing thing. Therefore, a bga reballing process was introduced as a fall back solution for a scenario in which leadfree components had to be populated on pcb assemblies.
Bga deballing process 7 bga reballing process 11 cleaning fixtures 16 bake and dry packaging 18 flexible fixture setup optional 20 reflow temperature profile 22 frequently asked questions 25 glossary 26 safety precautions 29 warranty 31 sm4064 rev a contact information winslow automation, inc. This procedure is also applicable to lead free products. Intel packaging databook 93 board reflow process recommendations revised 122007 9. The best performing reballing fluxes now available on the market. Placing new solder balls onto clean component, using the reballing stencil. Bgacsp reballing by bob doetzer circuit technology inc.
The bga rework process can be methodically worked out by following these process guidelines though difference in printed circuit boards, devices populated on those boards. Alignment is simple with the edges of the preform being squared up with the sides of the package thereby eliminating the need to buy custom fixtures or frames. Profiling for successful bgacsp rework ok international. Fivestep process integrates flux, preheat, solder ball removal, water rinse, and dry. Tinlead sn63pb37 eutectic, lead free, and specialty alloys any ball size and ball pitch including chip scale packages processes are tailored to each part. The need for reballing is explained as well as the diifferent methods of reballing as a function of the number of devicss to be reballed and the type of bga package being reballed. Find our for yourself which bga reballing process produces the highest yield at the lowest possible cost.
We have been successfully reballing bga devices for years in accordance with ipc 7711 procedure 5. A data sheet of the device, including the mechanical drawing to cut the ministencil. Originally developed by raychem corporation in 1994, the solderquik solder preform is the lowvolume ball attach solution. Component manufacturers specify no more than 3 reflow cycles for their components, so this laser process enables our customers to. This involves removing the current solder balls off the pads and reflowing new solder balls on the pads. Alignment is simple with the edges of the preform being squared up with the sides of the package thereby. Mar 29, 2014 iphone 7 cpu repair iphone 7 islemci sokumu a10 cpu repair 1 erorr 4014 erorr 40 erorr duration. A tc should be used in a joint at one corner of the component, and in a joint at the center of the part, or as near to the center of the part as possible. Bga reballing services micross ball attach deballing. Years of experience, the correct equipment and a robust bga rework process all help to insure high expected yields. How to properly prepare the bga to reduce heat and moisture damage. Device needs reballing ball removal by dissolution in molten solder ball removal by dissolution in molten solder followed by hot air knife ball removal by melting and wicking manual process. The reballing process continues by removing the existing solder balls and cleaning the reballing is also performed when the only available parts on the market have leadfree solder balls, and the application requires eutectic solder. The process is completed by placing the prepared bare bga component onto the solder balls on the board and reflowing using the same profile used for standard rework process.
Stencilquik reballing this best developed reballing technique for area array devices is the designed for speed and fast turnaround of small to medium volume. Tinlead sn63pb37 eutectic, leadfree, and specialty alloys any ball size and ball pitch including chip scale packages processes are tailored to each part. Reliability assessment on the reballing of pbga semantic scholar. Also included is a contactless removal of residual solder from. It is always preferable to use a new bga when bga reballing is required. The third option is to perform bga reballing, which especially takes on increased significance as original equipment manufacturers oem continue to populate pcbs with a large number of leadfree bga components 5. Figure 1 figure 2 figure 3 figure 4 7711 rework revision. This article will discuss the process of reballing bga components figure 1, examining preparation the preform method, the screen method, and cleaning and.
This repair process is applied when saving valuable resources and money is crucial or when the value chain has to be extended. Array reballing is typically needed when a bga has been misplaced on the placement line, when solder paste pressure has not been sufficient, or when the pads of the circuit board are oxidized and there is no contact. Winslow automations patented solderquik bga preform is the solution to all of your ball attach and bga reballing needs. Todays demanding rework applications, including reballing bgas, require reliable solutions that directly address the specific challenges involved with each type of rework process. Iects 626474 bga reballing top level table of contents forward introduction 1. Retronix have installed a top of the line system which will set a benchmark for an advanced and reliable laser reballing service. When reworking or replacing a part due to manufacturing or part defect, the work is typically done by hand soldering, a manual process that is then verified by the operator through manual inspection.
In the case of ball grid array bga components this is done by a reballing process. The reballed component can then be transferred to the apr scorpion. This article describes the required bga reballing process. Specific control parameters are clearly defined for.
Solderquik bga reballing preforms winslow automation. Isi has an advanced, qualified process for removing and reballing solder spheres that is compatible to the assembly process. The ball attach and reballing process consists of three steps 1 deball, 2 sphere placement, and 3 reflow. In the case of bga rework, it is a challenge to provide the. Rework, modification and repair of electronic assemblies. Jaywn, reballing is usually performed to replace a bga ic, not a device. This system provides reproducible solder bumping technology for packaging optoelectronic devices, mems, sensors, bgas, clccs, csps, flip chips and many more. Bga solderability testing for analysis per jstd002c test s. The clear advantage for process controlled bga installations can be seen in. Micross has developed a proven process for deballingreballing ball grid array bga components to restore them to their original specifications or to bring them up to standards for use in hirel applications. Iec ts 626474 process management for avionics aerospace and defense electronic systems containing leadfree solder part 4. Bga component reballing services are available for bga components with 0.
585 1547 493 977 1209 1224 221 1425 438 331 187 918 1410 723 924 988 221 1024 203 973 758 501 556 664 23 266 653 1461 200 1377 446 402 1379 365 497 874